The Dynamics of a Small-Scale Portable Electronics Device Under Impact Stimuli
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[1] Zhaowei Zhong,et al. Impact life prediction modeling of TFBGA packages under board level drop test , 2004, Microelectron. Reliab..
[2] J. Wu,et al. Drop/impact simulation and test validation of telecommunication products , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).
[3] E. Suhir. Could shock tests adequately replace drop tests? , 2002, 2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617).
[4] K R Williams,et al. The relationship between mass and acceleration for impacts on padded surfaces. , 1994, Journal of biomechanics.
[5] Paul S. Addison,et al. The Illustrated Wavelet Transform Handbook , 2002 .
[6] Chwee Teck Lim,et al. Drop impact survey of portable electronic products , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[7] Jim Papadopoulos,et al. The Dynamics of Clattering I: Equation of Motion and Examples , 1998 .
[8] P. D. McFadden,et al. A review of time-frequency methods for structural vibration analysis , 2003 .
[9] Jeff Punch,et al. Analysis of Experimental Shock and Impact Response Data of a Printed Wire Board , 2003 .
[10] Herbert Kolsky,et al. Stress Waves in Solids , 2003 .
[11] Raymond Higgins,et al. The properties of engineering materials , 1977 .