论文信息 - Effect of Dielectric Capping Layer on TDDB Lifetime of Cu Interconnects in SiOF - 字舞流文

Effect of Dielectric Capping Layer on TDDB Lifetime of Cu Interconnects in SiOF

J. Gambino | M. Shinosky | Fen Chen | Tom C. Lee | John He | S. Mongeon | P. Pokrinchak | Dave Mosher