Failure Modes of Flip Chip Solder Joints Under High Electric Current Density

The failure modes of flip chip solder joints under high electrical current density are studied experimentally. Three different failure modes are reported. Only one of the failure modes is caused by the combined effect of electromigration and thermomigration, where void nucleation and growth contribute to the ultimate failure of the module. The Ni under bump metallization–solder joint interface is found to be the favorite site for void nucleation and growth. The effect of pre-existing voids on the failure mechanism of a solder joint is also investigated

[1]  C. Basaran,et al.  Failure modes and FEM analysis of power electronic packaging , 2002 .

[2]  Yangyuan Wang,et al.  Numerical calculation of electromigration under pulse current with Joule heating , 1999 .

[3]  Conyers Herring,et al.  Stress generation by electromigration , 1976 .

[4]  B. J. Klein.  Electromigration in thin gold films , 1973 .

[5]  M. Meyers,et al.  Self-organization of shear bands in titanium and Ti–6Al–4V alloy , 2002 .

[6]  Hua Ye,et al.  Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing , 2003 .

[7]  William D. Nix,et al.  An Analysis of Void Nucleation In Passivated Interconnect Lines Due to Vacancy Condensation and Interface Contamination , 1996 .

[8]  P. S. Ho,et al.  Diffusion Phenomena in Thin Films and Microelectronic Materials , 1989 .

[9]  D. R. Frear,et al.  Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization , 2001 .

[10]  Hua Ye,et al.  Numerical simulation of stress evolution during electromigration in IC interconnect lines , 2003 .

[11]  M. Korhonen,et al.  Stress evolution due to electromigration in confined metal lines , 1993 .

[12]  Rishi Raj,et al.  Nucleation of cavities at second phase particles in grain boundaries , 1978 .

[13]  G. Povirk,et al.  Numerical Simulations of Electromigration and Stress-Driven Diffusion in Polycrystalline Interconnects , 1997 .

[14]  Eicke R. Weber,et al.  Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines , 1997 .

[15]  C. Basaran,et al.  Experiment study on reliability of solder joints under electrical stressing: Nano-indentation, atomic flux measurement , 2002 .

[16]  T. M. Makhviladze,et al.  General model for mechanical stress evolution during electromigration , 1999 .

[17]  Young-Joon Park,et al.  Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects , 1999 .

[18]  Reiner Kirchheim,et al.  Stress and electromigration in Al-lines of integrated circuits , 1992 .

[19]  James R. Lloyd,et al.  Electromigration in integrated circuit conductors , 1999 .

[20]  Michael F. Ashby,et al.  Intergranular fracture at elevated temperature , 1975 .

[21]  C. Basaran,et al.  Damage mechanics of microelectronics solder joints under high current densities , 2003 .

[22]  Paul A. Flinn,et al.  Mechanical Stress in VLSI Interconnections: Origins, Effects, Measurement, and Modeling , 1995 .

[23]  I. Blech,et al.  Measurement of stress gradients generated by electromigration , 1977 .

[24]  Hua Ye,et al.  Measurement and effects of high electrical current stress in solder joints , 2002 .

[25]  E. Kinsbron,et al.  Electromigration in thin gold films on molybdenum surfaces , 1975 .

[26]  E. S. Meieran,et al.  Electromigration in Thin Al Films , 1969 .

[27]  J. P. Hirth,et al.  Analysis of cavity nucleation in solids subjected to external and internal stresses , 1985 .

[28]  William D. Nix,et al.  A physically based model of electromigration and stress-induced void formation in microelectronic interconnects , 1999 .

[29]  I. Blech.  Electromigration in thin aluminum films on titanium nitride , 1976 .

[30]  D. R. Frear,et al.  Electromigration of eutectic SnPb solder interconnects for flip chip technology , 2001 .