Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

In relation to power converter design, power density is increasing while the form factor is decreasing. This trend generally reduces the rate of the cooling process, which increases the mutual thermal coupling among the surrounding power components. Most of the traditional models usually ignore the mutual effects or just focus on the conduction coupling. To deal with these factors, the thermal modeling for a boost converter system has been built to compare the junction temperatures (Tj) and the increments under different working conditions in order to consider the conduction coupling. A multi-variable thermal resistances model is proposed in this paper to incorporate the convection thermal coupling into the mutual thermal effects. The coupling resistances, MOSFET to the diode ( Appl. Sci. 2019, 9, 3240 10 of 15 4.2. Self-Resistances Calculation Rjc is in the process of thermal conduction which can be obtained from the datasheet. The method to calculate Rca in the steady state is given as:

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