Multiple scattering among vias in planar waveguides using preconditioned SMCG method

Full-wave modeling for cylindrical vias in planar waveguides is formulated using Foldy-Lax multiple scattering equations. Recently, a sparse-matrix canonical-grid method based on fast Fourier transform and an iterative algorithm was proposed to solve a large-scale via problem. In this paper, we further improve computational efficiency by a preconditioning scheme based on the dominant information contained in the near field. We also discuss two methods-the sparse-matrix LU decomposition and sparse matrix iterative methods-for constructing the preconditioner, providing the tradeoffs between CPU time and memory. Results show an order of magnitude improvement over the nonpreconditioned case on the convergence rate. As an example, for 20 000 vias simulation, the solution time (per excitation and per frequency) is approximately 13 s per iteration, and 75 min to reach convergence in 320 iterations with memory requirements of 560 MB on a single Pentium 2.4-GHz processor machine. Numerical simulations are illustrated for physical problems such as ball-grid array and large-scale randomly distributed vias, where we have observed the shielding effects of the terminated vias that reduce the coupling between vias.

[1]  J. Kong,et al.  Scattering of Electromagnetic Waves, Numerical Simulations , 2001 .

[2]  Jong-Gwan Yook,et al.  Characterization of high frequency interconnects using finite difference time domain and finite element methods , 1994 .

[3]  J. P. Quine,et al.  Characterization of via connections in silicon circuit boards , 1988 .

[4]  Albert E. Ruehli,et al.  Solution of a complex via-pin connector problem using the partial element equivalent circuit (PEEC) method , 1999, 1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261).

[5]  R. Harrington,et al.  Quasi-static analysis of a microstrip via through a hole in a ground plane , 1988 .

[6]  L. Tsang,et al.  Modeling of multiple scattering among vias in planar waveguides using Foldy–Lax equations , 2001 .

[7]  F. Olyslager,et al.  Study of the ground bounce caused by power plane resonances , 1998 .

[8]  Andrew F. Peterson,et al.  Rigorous and simplified models for the capacitance of a circularly symmetric via , 1997 .

[9]  Qin Li,et al.  Quasi‐static parameters, low‐frequency solutions, and full‐wave solutions of a single‐layered via , 2002 .

[10]  Chang-Yu Wu,et al.  The restriction on delta-I noise along the power/ground layer in the highspeed digital printed circuit board , 1998, 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253).

[11]  Leung Tsang,et al.  Multiple scattering among vias in lossy planar waveguides using SMCG method , 2002 .

[12]  Ruey-Beei Wu,et al.  Full-wave characterization of a through hole via in multi-layered packaging , 1995 .

[13]  Qin Li,et al.  Analysis of a large number of vias and differential signaling in multilayered structures , 2003 .

[14]  Tapan K. Sarkar,et al.  Computation of Inductance of Simple Vias Between Two Striplines Above a Ground Plane (Short Papers) , 1985 .

[15]  Leung Tsang,et al.  A sparse‐matrix canonical‐grid method for scattering by many scatterers , 1995 .

[16]  Daniël De Zutter,et al.  Capacitance of a circular symmetric model of a via hole including finite ground plane thickness , 1991 .

[17]  Jin Au Kong,et al.  Coupled noise analysis for adjacent vias in multilayered digital circuits , 1994 .

[18]  Raj Mittra,et al.  Computation of the equivalent capacitance of a via in a multilayered board using the closed-form Green's function , 1996 .

[19]  Jiayuan Fang,et al.  Shorting via arrays for the elimination of package resonance to reduce power supply noise in multi-layered area-array IC packages , 1998, Proceedings. 1998 IEEE Symposium on IC/Package Design Integration (Cat. No.98CB36211).

[20]  L. Tsang,et al.  A sparse-matrix/canonical grid method for analyzing densely packed interconnects , 2000 .

[21]  Daniël De Zutter,et al.  Modelling complex via hole structures , 2001 .

[22]  Raj Mittra,et al.  Time-domain electromagnetic analysis of interconnects in a computer chip package , 1992 .