Residual stress in spark-plasma-sintered and hot-pressed tantalum samples determined by X-ray diffraction methods
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Khiam Aik Khor | L. G. Yu | E. Neubauer | K. Khor | Lai Gui Yu | W. Artner | E. Neubauer | P. Angerer | P. Angerer | W. Artner
[1] J. Cohen,et al. Residual Stress: Measurement by Diffraction and Interpretation , 1987 .
[2] P. Staron,et al. On the development of grain growth resistant tantalum alloys , 2006 .
[3] E. MacDonald,et al. Recrystallization textures in tantalum sheet and wire , 2000 .
[4] J. Groza,et al. Sintering activation by external electrical field , 2000 .
[5] K. Khor,et al. Texture and structure evolution of tantalum powder samples during spark-plasma-sintering (SPS) and conventional hot-pressing , 2007 .
[6] C. A. Michaluk,et al. Tantalum and its alloys , 1992 .
[7] M. Sharma,et al. Sintering and electrical properties of tantalum anodes for capacitor applications , 2002 .
[8] A. Krawitz,et al. Introduction to Diffraction in Materials Science and Engineering , 2001 .
[9] G. S. Upadhyaya. Powder metallurgical processing and metal purity: A case for capacitor grade sintered tantalum , 2005 .
[10] S. Lee,et al. Phase, residual stress, and texture in triode-sputtered tantalum coatings on steel. Final report , 1998 .
[11] M. Tokita. Development of Large-Size Ceramic/Metal Bulk FGM Fabricated by Spark Plasma Sintering , 1999 .
[12] Arnold C. Vermeulen,et al. Stress analysis of polycrystalline thin films and surface regions by X-ray diffraction , 2005 .