Room-Temperature Bonding of Vertical-Cavity Surface-Emitting Laser Chips on Si Substrates Using Au Microbumps in Ambient Air
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Tadatomo Suga | Renshi Sawada | Eiji Higurashi | Ryo Takigawa | T. Suga | R. Sawada | E. Higurashi | R. Takigawa
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Tadatomo Suga | Renshi Sawada | Eiji Higurashi | Ryo Takigawa | T. Suga | R. Sawada | E. Higurashi | R. Takigawa