A numerical and experimental study on gap compensation and wavelength selection in UV-lithography of ultra-high aspect ratio SU-8 microstructures
暂无分享,去创建一个
[1] Yong-Kweon Kim,et al. UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole , 2000 .
[2] Kun Lian,et al. Improved patterning quality of SU-8 microstructures by optimizing the exposure parameters , 2000, Advanced Lithography.
[3] M. Brunet,et al. Advanced photoresist technologies for microsystems , 2001 .
[4] Jian Zhang,et al. Polymerization optimization of SU-8 photoresist and its applications in microfluidic systems and MEMS , 2001 .
[5] F. Tseng,et al. Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination , 2002 .
[6] Gwo-Bin Lee,et al. A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist , 2002 .
[7] Paul M. Dentinger,et al. High aspect ratio patterning with a proximity ultraviolet source , 2002 .
[8] P. Maciel,et al. Top-edge profile control for SU-8 structural photoresist , 2003, Proceedings of the 15th Biennial University/Government/ Industry Microelectronics Symposium (Cat. No.03CH37488).
[9] Wanjun Wang,et al. Study on the postbaking process and the effects on UV lithography of high aspect ratio SU-8 microstructures , 2004 .
[10] Wanjun Wang,et al. Using megasonic development of SU-8 to yield ultra-high aspect ratio microstructures with UV lithography , 2004 .