(Invited) Room Temperature Bonding of Wafers with Thin Nanocrystalline Metal Films

The bonding of two nanocrystalline metal films that are sputter-deposited on micro-polished wafers [1,2] is a promising candidate process to achieve wafer bonding at room temperature, in addition to the surface activated bonding [3,4]. In this study, bonding between two flat wafers with thin metal films was studied for 16 thin metal films with various crystal structures and self-diffusion coefficients, and we discuss the potential of this bonding method for applications.