Nucleation and microtexture development under dynamic recrystallization of copper

Microstructure and microtexture evolution during dynamic recrystallization (DRX) was investigated in compression of polycrystalline copper in the temperature range from 473 K to 723 K and at strain rates from 10−3s−1 to 10−1s−1. A compression texture of near 〈101〉 direction, evolved by low temperature deformation, is gradually weakened and randomized by the progress of DRX at higher temperature, where 〈101〉 component still exists. New DRX grains are evolved by the operation of bulging of serrated grain boundaries, which is accompanied either by rotation of a bulged portion or twinning at the back of the migrating boundary. The mechanisms of dynamic nucleation and necklace DRX are discussed.