Packaging using microelectromechanical technologies and planar components
暂无分享,去创建一个
Hiroshi Ogura | Hiroyuki Yabuki | M. Matsuo | Suguru Fujita | T. Urabe | Ushio Sangawa | Kazuaki Takahashi
[1] Morikazu Sagawa,et al. An advanced millimeter-wave flip-chip IC integrating different kinds of active devices , 1996, 1996 IEEE MTT-S International Microwave Symposium Digest.
[2] Mitsuo Makimoto,et al. Stripline dual-mode ring resonators and their application to microwave devices , 1996 .
[3] Mitsuo Makimoto,et al. Analysis of resonant characteristics for a one‐wavelength ring resonator coupled with two orthogonal resonant modes , 1999 .
[4] Hiroshi Ogura,et al. Millimeter-wave Transceiver MCM Usig Multi-layer BCB with Integrated Planner Antenna , 1999, 1999 29th European Microwave Conference.
[5] G.M. Rebeiz,et al. Micromachined self-packaged W-band bandpass filters , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.
[6] Kazuaki Takahashi,et al. Development of K-Band Front-End Devices for Broadband Wireless Communication Systems Using Millimeter-Wave Flip-Chip IC Technology , 1998 .
[7] Linda P. B. Katehi,et al. Development of self-packaged high frequency circuits using micromachining techniques , 1995 .
[8] Kazuaki Takahashi,et al. Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding , 1999 .
[9] S. Fujita,et al. K-band receiver front-end IC integrating micromachined filter and flip-chip assembled active devices , 1999, 1999 IEEE MTT-S International Microwave Symposium Digest (Cat. No.99CH36282).