Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions

In this paper, we present an implementation of a thermal modelling method applied to a multichip module used as a power converter. Analytical functions of thermal impedances, with original formulations for the mutuals are defined. They are derived from 3D thermal simulations and experimental validations with direct chips temperature measurements. Finally, simulations are performed in order to improve the capability of our model to assess, with fast computation, the thermal constraints applied on the multichip module in a real operating condition.

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