A study of SW150 conductive paste as a possible use in solderless assembly for electronics

Although only at the stage of proof of concept, a basic approach in Occam technology is: placement of components on a dielectric substrate, encapsulation, reversal of the substrate, drilling down to pins of components, creation of conductive traces, a.s.o. Since a reversed order of construction of a simple circuit is considered to be much cheaper in terms of required equipment, this paper presents some preliminary tests regarding conductive traces issues. As new materials [1] and new technologies [2, 3] are emerging on the market, a new conductive paste proposed to interconnect layers of a multi-layer printed circuit board through filled vias [4] was used to create traces. Printing of conductive paste and electrical measurements at the pin and trace interface were investigated.