Opposite-channel-based injection of hot-carriers in SOI MOSFET's: physics and applications

An extensive study of the recently observed opposite-channel-based injection (OCBI) of hot-carriers in SOI MOSFET's is carried out by PISCES numerical calculations. The study reveals similar patterns of injection for partially-depleted (PD) and fully-depleted (FD) devices, although there are significant quantitative differences. Important differences also exist when stressing the device with the body floating versus body grounded. The results demonstrate that when stressing one channel, carriers can and are injected into the opposite gate. The results also demonstrate that under appropriate bias conditions pure electron/hole injection takes place, and establish these conditions. The practical significance of this ability to inject only electrons or only holes in any desired sequence is illustrated by exploiting it to investigate the time-power law of interface state generation and to design a SOI EEPROM cell with a back channel based erasing scheme.

[1]  G. A. Armstrong,et al.  Simulation of ultra thin film SOI transistors using a non-local ballistic model for impact ionisation , 1992 .

[2]  S. Li,et al.  Electrical Characterization of Silicon-On-Insulator Materials and Devices , 1995 .

[3]  S.S. Eaton,et al.  The effect of a floating substrate on the operation of silicon-on-sapphire transistors , 1978, IEEE Transactions on Electron Devices.

[4]  S. Cristoloveanu,et al.  Characterization of carrier generation in enhancement-mode SOI MOSFET's , 1990, IEEE Electron Device Letters.

[5]  D. Wouters,et al.  Subthreshold slope in thin-film SOI MOSFETs , 1990 .

[6]  Hot hole induced interface state generation and annihilation in SOI MOSFETs , 1996, IEEE Electron Device Letters.

[7]  H. Hughes,et al.  Time dependence power laws of hot carrier degradation in SOI MOSFETS , 1996, 1996 IEEE International SOI Conference Proceedings.

[8]  H. Hughes,et al.  Hot-electron-induced degradation of front and back channels in partially and fully depleted SIMOX MOSFETs , 1992, IEEE Electron Device Letters.

[9]  H. Hughes,et al.  Interface characterization of fully depleted SOI MOSFETs by the dynamic transconductance technique , 1991, IEEE Electron Device Letters.

[10]  J. Tihanyi,et al.  Influence of the floating substrate potential on the characteristics of ESFI MOS transistors , 1975 .

[11]  Hyung-Kyu Lim,et al.  Threshold voltage of thin-film Silicon-on-insulator (SOI) MOSFET's , 1983, IEEE Transactions on Electron Devices.

[12]  K. K. Young,et al.  Avalanche-induced drain-source breakdown in silicon-on-insulator n-MOSFETs , 1988 .

[13]  G. A. Armstrong,et al.  Characterization of bipolar snapback and breakdown voltage in thin-film SOI transistors by two-dimensional simulation , 1991 .

[14]  Chenming Hu,et al.  Hot-electron-induced photon and photocarrier generation in Silicon MOSFET's , 1984, IEEE Transactions on Electron Devices.

[15]  J. Colinge,et al.  Bulk traps in ultrathin SIMOX MOSFET's by current DLTS , 1988, IEEE Electron Device Letters.

[16]  C. Hu,et al.  Lucky-electron model of channel hot-electron injection in MOSFET'S , 1984 .

[17]  D. Ioannou,et al.  LDD design tradeoffs for single transistor latch-up and hot carrier degradation control in accumulation mode FD SOI MOSFET's , 1997 .

[19]  K. K. Young Short-channel effect in fully depleted SOI MOSFETs , 1989 .

[20]  Opposite-channel-based charge injection in SOI MOSFET's under hot carrier stress , 1995 .

[21]  Dimitris E. Ioannou,et al.  Investigation of carrier generation in fully depleted enhancement and accumulation mode SOI MOSFET's , 1994 .

[22]  Successive charging/discharging of gate oxides in SOI MOSFET's by sequential hot-electron stressing of front/back channel , 1993, IEEE Electron Device Letters.

[23]  Detailed characterization and analysis of the breakdown voltage in fully depleted SOI n-MOSFET's , 1994 .

[24]  J. Faricelli,et al.  Examination of the time power law dependencies in hot carrier stressing of n-MOS transistors , 1997, IEEE Electron Device Letters.

[25]  H.E. Maes,et al.  Observation of hot-hole injection in NMOS transistors using a modified floating-gate technique , 1986, IEEE Transactions on Electron Devices.

[26]  Denis Flandre,et al.  Design and performance of a new flash EEPROM on SOI(SIMOX) substrates , 1994, Proceedings. IEEE International SOI Conference.

[27]  C. Werner,et al.  Hot-electron and hole-emission effects in short n-channel MOSFET's , 1985, IEEE Transactions on Electron Devices.

[28]  L. T. Su,et al.  Hot-carrier effects in fully-depleted SOI nMOSFETs , 1992, 1992 International Technical Digest on Electron Devices Meeting.

[29]  Jerry G. Fossum,et al.  Analysis and control of floating-body bipolar effects in fully depleted submicrometer SOI MOSFET's , 1991 .

[30]  Dimitris E. Ioannou,et al.  Surface potential at threshold in thin-film SOI MOSFET's , 1993 .

[31]  Hyung-Kyu Lim,et al.  Current-voltage characteristics of thin-film SOI MOSFET's in strong inversion , 1984, IEEE Transactions on Electron Devices.

[32]  Jerry G. Fossum,et al.  Dynamic floating-body instabilities in partially depleted SOI CMOS circuits , 1994, Proceedings of 1994 IEEE International Electron Devices Meeting.

[33]  Sorin Cristoloveanu,et al.  Properties of ultra-thin wafer-bonded silicon-on-insulator MOSFET's , 1991 .

[34]  Cheng T. Wang,et al.  Hot carrier design considerations for MOS devices and circuits , 1992 .

[35]  J. Colinge Silicon-on-Insulator Technology: Materials to VLSI , 1991 .

[36]  J. Colinge Silicon-on-Insulator Technology , 1991 .

[37]  A. Wei,et al.  Measurement of transient effects in SOI DRAM/SRAM access transistors , 1996, IEEE Electron Device Letters.