Process characterization and reliability for the assembly of 01005 chip components

Purpose – The purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components.Design/methodology/approach – During the study, solder paste printing process‐related variables, such as solder paste type, stencil type, and stencil opening ratio, and pick and place process‐related methods, such as vision camera type and vacuum pickup nozzle type were evaluated with the goal of achieving a high‐yield assembly solution for 01005 chip components. A test board was used in a series of designed experiments to optimize the solder paste printing, pick and placement, and reflow processes. Assembly defects were analyzed as a function of the stencil design and the assembly processes.Findings – The results of the study indicated that both electroformed and electropolished laser‐cut stencils had a comparable print quality with respect to the solder volume delivered to the pads. In terms of assembly yield performance, type 4 (size range: 20‐38 μm) solder paste w...