论文信息 - Testing of the thermal model of microprocessor

Testing of the thermal model of microprocessor

The thermal, laboratory model of multi-core microprocessor was fabricated and analyzed. It consists of four separately powered thick-film resistors. Moreover, thermoelectric temperature sensor, suitable for monitoring of small and dynamic temperature changes on the microprocessor/heat sink border, was designed and tested. It consists of two separate substrates connected by nickel and silver wires. It's resolution is 113 μΥ/Κ. Static and dynamic measurements of the microprocessor model were carried out using the pyrometers or designed sensor.

Andrzej Dziedzic | Piotr Markowski | Mirosław Gierczak

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