论文信息 - Application of the ultrasonic pulse-echo technique for quality control of the multi-layered electronic components

Application of the ultrasonic pulse-echo technique for quality control of the multi-layered electronic components

The objective of the presented work was enhancement of quality of ultrasonic images of electronic components, obtained by the pulse-echo ultrasonic technique. For this purpose a novel signal processing method based on the adaptive ultrasonic numerical model of the electronic device and selection of the appropriate time and frequency regions has been proposed

Renaldas Raisutis | Rymantas Kažys | L. Mažeika | A. Vladišauskas

[1] Linas Svilainis,et al. Ultrasonic detection and characterization of delaminations in thin composite plates using signal processing techniques , 1997 .

[2] Linas Svilainis,et al. Analysis of adaptive imaging algorithms for ultrasonic non-destructive testing , 1995 .

[3] Ik-Keun Park,et al. Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor , 2002 .

[4] J. Collet. Solid-State Electronics , 1963, Nature.

[5] Pasquale Daponte,et al. An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy , 2003, IEEE Trans. Instrum. Meas..