On the Nature of Critical Heat Flux in Microchannels

The critical heat flux (CHF) limit is an important consideration in the design of most flow boiling systems. Before the use of microchannels under saturated flow boiling conditions becomes widely accepted in cooling of high-heat-flux devices, such as electronics and laser diodes, it is essential to have a clear understanding of the CHF mechanism. This must be coupled with an extensive database covering a wide range of fluids, channel configurations, and operating conditions. The experiments required to obtain this information pose unique challenges. Among other issues, flow distribution among parallel channels, conjugate effects, and instrumentation need to be considered. An examination of the limited CHF data indicates that CHF in parallel microchannels seems to be the result of either an upstream compressible volume instability or an excursive instability rather than the conventional dryout mechanism. It is expected that the CHF in parallel microchannels would be higher if the flow is stabilized by an orifice at the entrance of each channel. The nature of CHF in microchannels is thus different than anticipated, but recent advances in microelectronic fabrication may make it possible to realize the higher power levels.

[1]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[2]  Satish G. Kandlikar,et al.  Evolution of Microchannel Flow Passages--Thermohydraulic Performance and Fabrication Technology , 2003 .

[3]  Issam Mudawar,et al.  High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks , 1994 .

[4]  T. Kenny,et al.  Enhanced nucleate boiling in microchannels , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

[5]  Amir Faghri,et al.  A New Two-Phase Flow Map and Transition Boundary Accounting for Surface Tension Effects in Horizontal Miniature and Micro Tubes , 2001 .

[6]  Satish G. Kandlikar,et al.  Two-Phase Flow Patterns, Pressure Drop, and Heat Transfer during Boiling in Minichannel Flow Passages of Compact Evaporators , 2002 .

[7]  Arthur E. Bergles,et al.  An experimental study of critical heat flux in very high heat flux subcooled boiling , 1994 .

[8]  Issam Mudawar,et al.  Prediction and measurement of incipient boiling heat flux in micro-channel heat sinks , 2002 .

[9]  R. Boyd,et al.  A New Facility for Measurements of Three-Dimensional, Local Subcooled Flow Boiling Heat Flux and Related Critical Heat Flux for PFCs , 2002 .

[10]  S. Quake,et al.  Microfluidic Large-Scale Integration , 2002, Science.

[11]  Y. Katto Critical heat flux , 1994 .

[12]  P. Griffith,et al.  A STUDY OF SYSTEM-INDUCED INSTABILITIES IN FORCED-CONVECTION FLOWS WITH SUBCOOLED BOILING. Technical Report No. 5382-35 , 1965 .

[13]  I. Mudawar,et al.  Measurement and correlation of critical heat flux in two-phase microchannel heat sinks , 2004 .

[14]  I. Mudawar,et al.  Critical heat flux (CHF) for water flow in tubes—II.: Subcooled CHF correlations , 2000 .

[15]  R. Shah,et al.  Fluid Flow and Heat Transfer at Micro- and Meso-Scales With Application to Heat Exchanger Design , 2000 .

[16]  I. Mudawar,et al.  Measurement and correlation of critical heat flux in two-phase micro-channel heat sinks , 2004 .

[18]  Satish G. Kandlikar Heat Transfer Mechanisms During Flow Boiling in Microchannels , 2004 .

[19]  I. Mudawar,et al.  Measurement and prediction of pressure drop in two-phase micro-channel heat sinks , 2003 .

[20]  Huiying Wu,et al.  Visualization and measurements of periodic boiling in silicon microchannels , 2003 .

[21]  Albert Mosyak,et al.  A uniform temperature heat sink for cooling of electronic devices , 2002 .

[22]  Man Wong,et al.  Phase change in microchannel heat sinks with integrated temperature sensors , 1999 .

[23]  I. Mudawar,et al.  Flow boiling heat transfer in two-phase micro-channel heat sinks--II. Annular two-phase flow model , 2003 .

[24]  A. E. Bergles,et al.  Review of two-phase flow instability , 1973 .

[25]  Jae-Mo Koo,et al.  Modeling of two-phase microchannel heat sinks for VLSI chips , 2001, Technical Digest. MEMS 2001. 14th IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.01CH37090).

[26]  A. Bergles ELEMENTS OF BOILING HEAT TRANSFER , 1992 .

[27]  Satish G. Kandlikar,et al.  Evaluation of Single Phase Flow in Microchannels for High Heat Flux Chip Cooling—Thermohydraulic Performance Enhancement and Fabrication Technology , 2004 .

[28]  Thomas W. Kenny,et al.  Two-phase microchannel heat sinks for an electrokinetic VLSI chip cooling system , 2001, Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189).

[29]  Issam Mudawar,et al.  Smart, low-cost, pumpless loop for micro-channel electronic cooling using flat and enhanced surfaces , 2002, ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258).

[30]  Thomas W. Kenny,et al.  Experimental study on two-phase heat transfer in microchannel heat sinks with hotspots , 2003, Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2003..

[31]  A. Bergles,et al.  Pool boiling from GEWA surfaces in water and R-113 , 1987 .

[32]  S. Kandlikar A Theoretical model to predict pool boiling CHF incorporating effects of contact angle and orientation , 2001 .