SMIT Center, Department of Microtechnology and Nanoscience, Chalmers University of Technology SE-41296 Gothenburg, Sweden With the development of semiconductor technology, electronic packaging technology with increasingly high integration density is needed. Solder is a traditional interconnect material widely used in electronic packaging industry, but now more attention is being paid to isotropic conductive adhesive (ICA) as an environmentally friendly interconnect material with advantages of low processing temperature, simple processing conditions and good manufacturability. However, compared with solder, reliability studies of ICA are still scarce. This paper aims to enrich the reliability study of ICA, by studying the reliability of a novel fast curing ICA which has a curing degree of 97.8% with 3 min of curing time at 150 . It was found that after 85 /85% RH humidity and heat test for 160 h, the bulk resistivity of ICA decreased about 82% and then remained stable. Besides, ICA embrittled as aging time extending.