Crosstalk modeling in multiwalled carbon nanotubes as interconnects using the compact RC model
暂无分享,去创建一个
Nasser Masoumi | Ahmad Hakimi | Hossein Sheikhassadi | N. Masoumi | A. Hakimi | Hossein Sheikhassadi
[1] N. Masoumi,et al. Time-Domain analysis of carbon nanotubes , 2008, 2008 7th International Caribbean Conference on Devices, Circuits and Systems.
[2] Y. Massoud,et al. On the Optimal Design, Performance, and Reliability of Future Carbon Nanotube-Based Interconnect Solutions , 2008, IEEE Transactions on Electron Devices.
[3] S. Datta,et al. Transport effects on signal propagation in quantum wires , 2005, IEEE Transactions on Electron Devices.
[4] Q.H. Liu,et al. Crosstalk Prediction of Single- and Double-Walled Carbon-Nanotube (SWCNT/DWCNT) Bundle Interconnects , 2009, IEEE Transactions on Electron Devices.
[5] M. S. Sarto,et al. Fast Transient Analysis of Next-Generation Interconnects Based on Carbon Nanotubes , 2010, IEEE Transactions on Electromagnetic Compatibility.
[6] A. Maffucci,et al. A New Circuit Model for Carbon Nanotube Interconnects With Diameter-Dependent Parameters , 2009, IEEE Transactions on Nanotechnology.
[7] K. Banerjee,et al. On the Applicability of Single-Walled Carbon Nanotubes as VLSI Interconnects , 2009, IEEE Transactions on Nanotechnology.
[8] M. S. Sarto,et al. Single-Conductor Transmission-Line Model of Multiwall Carbon Nanotubes , 2010, IEEE Transactions on Nanotechnology.
[9] C. Xu,et al. Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status and Prospects , 2009 .
[10] C. Xu,et al. Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects , 2009, IEEE Transactions on Electron Devices.
[11] N. Masoumi,et al. A New and Efficient Approach for Estimating the Time-Domain Response of Capacitive Coupled Distributed RC Interconnects , 2008, 2008 12th IEEE Workshop on Signal Propagation on Interconnects.
[12] Ahmad Atghiaee,et al. TSV-aware IDF-based power prediction for FPGA , 2010, 2010 IEEE 14th Workshop on Signal Propagation on Interconnects.
[13] M. Bockrath. Carbon Nanotubes: Electrons in One Dimension , 1999 .
[14] J. Meindl,et al. Performance Modeling for Single- and Multiwall Carbon Nanotubes as Signal and Power Interconnects in Gigascale Systems , 2008, IEEE Transactions on Electron Devices.
[15] J. Meindl,et al. Compact physical models for multiwall carbon-nanotube interconnects , 2006, IEEE Electron Device Letters.
[16] P. Burke. Luttinger liquid theory as a model of the gigahertz electrical properties of carbon nanotubes , 2002 .
[17] Ahmad Atghiaee,et al. A Predictive and Accurate Interconnect Density Function: The Core of a Novel Interconnect-Centric Prediction Engine , 2011, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[18] A. Maffucci,et al. A transmission line model for metallic carbon nanotube interconnects , 2008, Int. J. Circuit Theory Appl..
[19] K. Banerjee,et al. High-Frequency Analysis of Carbon Nanotube Interconnects and Implications for On-Chip Inductor Design , 2009, IEEE Transactions on Electron Devices.
[20] Ahmad Atghiaee,et al. Nano-scale early-design-stage prediction for crosstalk-induced power , 2010, 2010 3rd International Nanoelectronics Conference (INEC).
[21] J. Meindl,et al. Design and Performance Modeling for Single-Walled Carbon Nanotubes as Local, Semiglobal, and Global Interconnects in Gigascale Integrated Systems , 2007, IEEE Transactions on Electron Devices.
[22] Luca Benini,et al. Performability/Energy Tradeoff in Error-Control Schemes for On-Chip Networks , 2010, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.
[23] Nasser Masoumi,et al. A RC model for multiwalled carbon nanotubes as interconnects , 2011, 2011 IEEE EUROCON - International Conference on Computer as a Tool.
[24] Shinobu Fujita,et al. A 1 GHz integrated circuit with carbon nanotube interconnects and silicon transistors. , 2008, Nano letters.
[25] G. Miano,et al. Performance Comparison Between Metallic Carbon Nanotube and Copper Nano-Interconnects , 2008, IEEE Transactions on Advanced Packaging.
[26] K. Banerjee,et al. Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects , 2008, IEEE Transactions on Electron Devices.