Electrochemical Planarization for Multilevel Metallization

The authors describe an electrochemical planarization technology involving electroplating followed by electropolishing, resulting in a very flat surface containing embedded conductors. Electrochemical planarization technology has been used to produce silicon substrate multichip modules. Both the electroplating and electropolishing processes have a thickness uniformity of better than [+-] 2% ([+-]3[sigma]) across a 100 mm wafer.