Copper interconnect microanalysis and electromigration reliability performance due to the impact of TLP ESD

Electrostatic discharge events can degrade the electromigration (EM) reliability of devices. Transmission Line Pulsing (TLP) is used to simulate such an occurrence on copper interconnects and a study made on the impact of this on EM performance. Compelling evidence from TEM data suggests the change in the microstructure of the interconnects explains the creation of latent EM failures.

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