Micro-impact test on lead-free BGA balls on Au/electrolytic Ni/Cu bond pad
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Yuhuan Xu | Y. Chan | K. Tu | Yu-huan Xu | Shengquan Ou | K.N. Tu | M.O. Alam | Y.C. Chan | Shengquan E. Ou | M. Alam | Yuhuan Xu
[1] K. Tu,et al. Six cases of reliability study of Pb-free solder joints in electronic packaging technology , 2002 .
[2] Y. C. Chan,et al. Effect of 0.5 wt % Cu in Sn-3.5%ag solder on the interfacial reaction with Au/Ni metallization , 2003 .
[3] Kinuko Mishiro,et al. Effect of the drop impact on BGA/CSP package reliability , 2002, Microelectron. Reliab..
[4] King-Ning Tu,et al. Ductile-to-brittle transition in Sn–Zn solder joints measured by impact test , 2004 .
[5] J. Holt. Charpy Impact Test: Factors and Variables , 1990 .
[6] T. Chiu,et al. Effect of thermal aging on board level drop reliability for Pb-free BGA packages , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[7] James P. Schaffer,et al. The Science and Design of Engineering Materials , 1995 .
[8] K. Tu,et al. Impact reliability of solder joints , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[9] Kojiro F. Kobayashi,et al. Mechanical Strength and Microstructure of BGA Joints Using Lead-Free Solders , 2002 .