论文信息 - III/V Wafer Bonding Technology for Wafer-Level Fabrication of GaInAsP/InP Microring Resonators - 字舞流文

III/V Wafer Bonding Technology for Wafer-Level Fabrication of GaInAsP/InP Microring Resonators

H. Heidrich | P. Lindner | V. Dragoi | M. Alexe | L. Pintilie | M. Hamacher | C. Thanner | G. Mittendorfer