Flexible Chip-on-Flex (COF) and embedded Chip-in-Flex (CIF) packages by applying wafer level package (WLP) technology using anisotropic conductive films (ACFs)
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Jin-Woo Lee | Kyung-Wook Paik | Chang-Kyu Chung | Ho-Young Son | Kyoung-Lim Suk | Joong Do Kim | H.-Y Son | K. Paik | Kyoung-Lim Suk | C. Chung | J. Kim | Jin-Woo Lee
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