论文信息 - Constitutive relations on creep for SnAgCuRE lead-free solder joints - 字舞流文

Constitutive relations on creep for SnAgCuRE lead-free solder joints

Zhigang Chen | Yaowu Shi | Z. Xia

[1] Chen Zhigang,et al. Properties of Lead-Free Solder SnAgCu Containing Minute Amounts of Rare Earth , 2003 .

[2] J. W. Morris,et al. The creep behavior of In-Ag eutectic solder joints , 1999 .

[3] Hans Conrad,et al. Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints , 1995 .

[4] O. Ruano,et al. Microstructure and high temperature mechanical properties of tin , 1995 .

[5] Edward Chan-Jiun Jih,et al. Constitutive Behavior and Low Cycle Thermal Fatigue of 97Sn-3Cu Solder Joints , 1993 .

[6] Z. Mei,et al. Superplastic creep of eutectic tinlead solder joints , 1990 .

[7] J. Čadek. Creep in metallic materials , 1988 .

[8] Johannes Weertman,et al. Diffusion-controlled dislocation creep: a defense , 1979 .

[9] J. W. Morris,et al. Harper-dorn creep in al, pb, and sn , 1973 .