An efficient transport scheme for multimedia transport over wireless Internet

A method of manufacturing connection-type ceramic packages for integrated circuits is disclosed. A plurality of green ceramic sheets are prepared and punched to form notches in each sheet and recesses defining cavities for accommodating an integrated circuit element therein at predetermined positions in given sheets. A plurality of lead array patterns each corresponding to terminal areas of the element are printed on each surface of the sheets with a metallizing ink. The printed sheets are laminated one upon another while aligning with the aid of the notches under hot pressed condition to form a laminated body. The laminated body is longitudinally cut into a plurality of green ceramic strips while providing transverse snap lines for obtaining individual ceramic package units. A pattern corresponding to the lead array pattern is printed on both sides of each of the strips with a metallizing ink. The printed strip is sintered to ceramic strip, which is then subjected to a usual plating treatment. Thereafter, lead members are attached to the plated ceramic strip to form connection-type ceramic packages capable of being divided into individual ceramic package units.