Short time die attach characterization of leds for in-line testing application

The qualification of the die attach of light emitting diodes (LED) is a very important element of predicting the reliability of the package, as the temperature of the chip is strongly affected by the quality of the die attach. LED manufacturers are seeking for solutions to be able to test die attach quality in mass production. This paper describes our findings regarding LED package testing with a focus on die attach quality testing, necessary short measurement times only. Requirements against the physical testing and the further processing are shown based on our experimental findings.

[1]  M. Rencz,et al.  Die attach quality control of 3D stacked dies , 2004, IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium (IEEE Cat. No.04CH37585).

[2]  M. Rencz,et al.  Determining partial thermal resistances with transient measurements, and using the method to detect die attach discontinuities , 2002, Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311).

[3]  M. Lenz,et al.  Thermal transient characterization methodology for single-chip and stacked structures , 2005, Semiconductor Thermal Measurement and Management IEEE Twenty First Annual IEEE Symposium, 2005..

[4]  Andras Poppe,et al.  Testing the Die Attach Quality of 3D Stacked Dies , 2004 .

[5]  V. Székely,et al.  Fine structure of heat flow path in semiconductor devices: a measurement and identification method , 1988 .