The Stacking of Integrated Passive Devices, Substrates, and RFICs to make ultra-thin modules using Organic Liquid Crystalline Polymer (LCP) Technology

This paper presents the design of a 3 pole WLAN filter that utilizes integrated passive device (IPD) attached to a substrate to reduce size and improve filter performance increase yield, and achieve thinner modules. The design uses liquid crystalline polymer (LCP) technology as an alternative to LTCC and discrete solutions

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