Residual stress, microstructure, and structure of tungsten thin films deposited by magnetron sputtering

The residual stress and structural properties of tungsten thin films prepared by magnetron sputtering as a function of sputtering-gas pressure are reported. The films were analyzed in situ by a cantilever beam technique, and ex situ by x-ray diffraction, cross-sectional transmission electron microscopy (TEM), x-ray photoelectron spectroscopy, electron energy-loss spectrometry, and energy-filtered electron diffraction. It is found that the residual stress, microstructure, and surface morphology are clearly correlated. The film stresses, determined in real time during the film formation, depend strongly on the argon pressure and change from highly compressive to highly tensile in a relatively narrow pressure range of 12–26 mTorr. For pressures exceeding ∼60 mTorr, the stress in the film is nearly zero. It is also found that the nonequilibrium A15 W structure is responsible for the observed tensile stress, whereas the stable bcc W or a mixture of bcc W and A15 W are in compression. Cross-sectional TEM eviden...

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