Device structures for the modulation-doped high-electron-mobility transistor (MODFET or HEMT), the metal Schottky-barrier gate transistor (MESFET), and the permeable-base transistor (PBT) With 0.1- to 0.25-µm gate lengths have been examined for their millimeter-wave performance. In particular, their unity-current-gain frequency (fT), maximum oscillation frequency (fmax), and the stability of power gains are Compared. It is shown that in field-effect transistors with gate lengths below 0.25 µm, the high aspect ratio design approach, involving the ratio of the gate length to its associated depletion depth, needs to be extended to include the gate-to-drain separation in an effective gate-length concept. Using the charge-control approach in conjunction with the carrier velocity saturation effect, it is shown that the overall transit time delay across the total effective gate length results in an effective gate capacitance that is significantly larger than that due to the physical size of the gate itself. It is shown with specific examples that a successful design of these ultrasubmicrometer gate structures depends on the choice of the gate-to-drain separation (LGD) and the separation (do) between the gate and the channel sheet Charge, with an appropriate choice of doping concentration consistent with the desired drain voltage operation. The designs have been based on practically obtainable values of the gate and source series resistances. When the actual gate length is much smaller than LGD, as in the case of PBT's, it is shown that the stable power gain margin in these devices is determined by the square of the aspect ratio (LGD/do). The results show that an fmaxof approximately 350 GHz can be achieved from a MODFET structure with an effective gate length of 0.14 µm. In a PBT structure an fmaxexceeding 500 GHz can be achieved with an effective gate length of 0.15 µm, and in a similar MESFET structure an fmaxof approximately 450 GHz can be achieved. The device design approach presented clearly indicates the possibility of achieving FET'S operating beyond 200 GHz with useful power gains.
[1]
M. B. Das.
A high aspect ratio design approach to millimeter-wave HEMT structures
,
1985,
IEEE Transactions on Electron Devices.
[2]
M. B. Das.
High-frequency network properties of MOS transistors including the substrate resistivity effects
,
1969
.
[3]
J.C.M. Hwang,et al.
IVA-8 60-GHz GaAs low-noise MESFET's by molecular-beam epitaxy
,
1986,
IEEE Transactions on Electron Devices.
[4]
J. Rollett.
Stability and Power-Gain Invariants of Linear Twoports
,
1962
.
[5]
Kae Dal Kwack,et al.
A model for the current—Voltage characteristics of MODFET's
,
1986
.
[6]
Effect of doping profile variations on the performance of the permeable base transistor
,
1986,
IEEE Transactions on Electron Devices.
[7]
Y. Hirachi,et al.
A microwave power double-heterojunction high electron mobility transistor
,
1985,
IEEE Electron Device Letters.
[8]
M. B. Das,et al.
Design calculations for submicron gate-length AlGaAs/GaAs modulation-doped fet structures using carrier saturation velocity/charge-control model
,
1985
.
[9]
W. Kopp,et al.
High transconductance InGaAs/AlGaAs pseudomorphic modulation-doped field-effect transistors
,
1985,
IEEE Electron Device Letters.