Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes
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E. Beyne | S. Van Huylenbroeck | P. Absil | W. Guo | Mario Gonzalez | A. Karmarkar | K. El Sayed | G. van der Plas | Xiaopeng Xu