Towards a deeper understanding of plastic deformation in mono-crystalline silicon

[1]  Liangchi Zhang,et al.  Molecular dynamics simulation of phase transformations in silicon monocrystals due to nano-indentation , 2000 .

[2]  Liangchi Zhang,et al.  Effect of repeated nano-indentations on the deformation in monocrystalline silicon , 2000 .

[3]  Liangchi Zhang,et al.  Structure changes in mono-crystalline silicon subjected to indentation — yexperimental findings , 1999 .

[4]  Hiroaki Tanaka,et al.  On the Mechanics and Physics in the Nano-Indentation of Silicon Monocrystals. , 1999 .

[5]  G. Rozgonyi,et al.  Oxygen Precipitation Behavior in 300 mm Polished Czorchralski Silicon Wafers , 1999 .

[6]  M. Swain,et al.  Ultra-micro-indentation of silicon and compound semiconductors with spherical indenters , 1999 .

[7]  Liangchi Zhang,et al.  An understanding of the chemical effect on the nano-wear deformation in mono-crystalline silicon components , 1999 .

[8]  Bharat Bhushan,et al.  Nanoscale tribophysics and tribomechanics , 1999 .

[9]  Liangchi Zhang,et al.  Effect of ultraprecision grinding on the microstructural change in silicon monocrystals , 1998 .

[10]  Hiroaki Tanaka,et al.  Atomic scale deformation in silicon monocrystals induced by two-body and three-body contact sliding , 1998 .

[11]  Roderick R. Kunz,et al.  High resolution studies of crystalline damage induced by lapping and single-point diamond machining of Si(100) , 1996 .

[12]  E. Makino,et al.  Ductile-regime turning mechanism of single-crystal silicon , 1996 .

[13]  I. Zarudi,et al.  Subsurface damage in alumina induced by single-point scratching , 1996, Journal of Materials Science.

[14]  P. Stopka,et al.  Changes in surface area and composition during grinding of silicon in environments of various quality , 1995 .

[15]  I. Yonenaga,et al.  Subsurface Damage in Single Diamond Tool Machined SI Wafers , 1995 .

[16]  D. Callahan,et al.  The extent of phase transformation in silicon hardness indentations , 1992 .

[17]  T. Page,et al.  The deformation behavior of ceramic crystals subjected to very low load (nano)indentations , 1992 .

[18]  L. Zhang,et al.  Subsurface damage in single-crystal silicon due to grinding and polishing , 1996 .

[19]  N. Suh,et al.  Plastic deformation of silicon during contact sliding at ambient temperature , 1993, Journal of Materials Science.

[20]  Michael V. Swain,et al.  The Determination of Surface Plastic and Elastic Properties by Ultra Micro-indentation , 1991 .

[21]  Liangchi Zhang,et al.  On some fundamental problems in grinding , 1970 .