Enhanced cooling performance of stacked chips by structural modification for fractal micro-protrusions
暂无分享,去创建一个
Z. Wang | Lihua He | Jing Ni | Rong Li | Zhanbin Wu | M. Xiong | Min Kong | Juyong Zhang
[1] Zhi Hu XUE,et al. Data center energy conservation study utilizing loop heat pipes as a chip-level cooling technique and its industrial application , 2022, Applied Thermal Engineering.
[2] Naveen G. Patil,et al. A Combined Liquid Cold Plate and Heat Sink Based Hybrid Cooling Approach for the Temperature Control of Integrated Circuit Chips , 2022, Journal of Thermal Science and Engineering Apllications.
[3] Kai Zhang,et al. Study on the performance of a miniscale channel heat sink with Y-shaped unit channels based on entransy analysis , 2022, Applied Thermal Engineering.
[4] Junhui Li,et al. Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure , 2022, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[5] T. Hotta,et al. Performance enhancement of high heat generating IC chips using paraffin wax based mini-channels - A combined experimental and numerical approach , 2021 .
[6] E. Beyne,et al. Thermal analysis of 3D functional partitioning for high-performance systems , 2021, 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm).
[7] Zhien Zhang,et al. Multi-objective optimizations on thermal and hydraulic performance of symmetric and asymmetric bionic Y-shaped fractal networks by genetic algorithm coupled with CFD simulation , 2021 .
[8] W. Tao,et al. LED chip cooling system using ionic wind induced by multi-wire corona discharge , 2021, Applied Thermal Engineering.
[9] K. Vafai,et al. Analysis of hotspots and cooling strategy for multilayer three-dimensional integrated circuits , 2020 .
[10] Zhien Zhang,et al. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: A review , 2020 .
[11] Choong-Jae Lee,et al. Thermal and Thermomechanical Behaviors of the Fan-Out Package With Embedded Ag Patterns , 2020, IEEE Transactions on Components, Packaging and Manufacturing Technology.
[12] G. Ding,et al. Optimization of Microchannel Heat Sink with Rhombus Fractal-like Units for Electronic Chip Cooling , 2020 .
[13] Jianchao Cai,et al. Lattice Boltzmann simulation and fractal analysis of effective thermal conductivity in porous media , 2020 .
[14] Nabeel M. Abdulrazzaq,et al. Enhancing thermal-hydraulic performance of counter flow mini-channel heat sinks utilizing secondary flow: Numerical study with experimental validation , 2020 .
[15] F. Ebrahimi,et al. Thermal buckling and forced vibration characteristics of a porous GNP reinforced nanocomposite cylindrical shell , 2020, Microsystem Technologies.
[16] Haojie Li,et al. Theoretical and numerical investigation of embedded microfluidic thermal management using gradient distribution micro pin fin arrays , 2019, Applied Thermal Engineering.
[17] A. Miguel. Optimal Y-shaped constructs heat sinks under different size constraints , 2019, International Journal of Heat and Mass Transfer.
[18] Yuanqiang Luo,et al. Heat transfer and permeability of the tree-like branching networks , 2019, International Journal of Heat and Mass Transfer.
[19] Yunfei Yan,et al. Single/multi-objective optimizations on hydraulic and thermal management in micro-channel heat sink with bionic Y-shaped fractal network by genetic algorithm coupled with numerical simulation , 2019, International Journal of Heat and Mass Transfer.
[20] G. Xia,et al. Multi-parameter optimization for micro-channel heat sink under different constraint conditions , 2017 .
[21] Wei Liu,et al. Numerical and experimental studies on laminar hydrodynamic and thermal characteristics in fractal-like microchannel networks. Part B: Investigations on the performances of pressure drop and heat transfer , 2013 .
[22] Cheng-Xian Lin,et al. A Review of High-Heat-Flux Heat Removal Technologies , 2011 .
[23] Guanping Dong,et al. Numerical investigation of the fluid flow and heat transfer characteristics of tree-shaped microchannel heat sink with variable cross-section , 2020 .