Impact of soft and hard breakdown on analog and digital circuits

The influence of gate oxide breakdown of one MOS transistor on the functionality of simple analog and digital circuits is studied. The main changes in the transistor behavior such as the additional gate current as well as transconductance and threshold voltage degradation are pointed out and their respective impact on circuit characteristics is analyzed. With this approach, it is possible to identify critical transistors during the design stage and implement appropriate countermeasures. Depending on the application, some circuits may be functional even after breakdown of one of their transistors.

[1]  W. Abadeer,et al.  Structural dependence of dielectric breakdown in ultra-thin gate oxides and its relationship to soft breakdown modes and device failure , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

[2]  Chih Sieh Teng,et al.  Mismatch drift: a reliability issue for analog MOS circuits , 1992, 30th Annual Proceedings Reliability Physics 1992.

[3]  D. Schroeder,et al.  Consistent model for the voltage and temperature dependence of the soft breakdown conduction mechanism in ultrathin gate Oxides , 2004 .

[4]  Marcel J. M. Pelgrom,et al.  Transistor matching in analog CMOS applications , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

[5]  G. Guegan,et al.  Collapse of MOSFET drain current after soft breakdown and its dependence on the transistor aspect ratio W/L , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[6]  E. Vandamme,et al.  Impact of MOSFET oxide breakdown on digital circuit operation and reliability , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

[7]  Jordi Suñé,et al.  On the Weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination. Part II: experimental results and the effects of stress conditions , 2002 .

[8]  Teong-San Yeoh,et al.  Gate oxide breakdown model in MOS transistors , 1995, Proceedings of 1995 IEEE International Reliability Physics Symposium.

[9]  R. Degraeve,et al.  Understanding nMOSFET Characteristics after Soft Breakdown and Their Dependence on the Breakdown Location , 2002, 32nd European Solid-State Device Research Conference.

[10]  G. Ghibaudo,et al.  A thorough investigation of progressive breakdown in ultra-thin oxides. Physical understanding and application for industrial reliability assessment , 2002, 2002 IEEE International Reliability Physics Symposium. Proceedings. 40th Annual (Cat. No.02CH37320).

[11]  Anthony S. Oates,et al.  Stress-induced MOSFET mismatch for analog circuits , 2001, 2001 IEEE International Integrated Reliability Workshop. Final Report (Cat. No.01TH8580).

[12]  Teong-San Yeoh,et al.  Influence of MOS transistor gate oxide breakdown on circuit performance , 1998, ICSE'98. 1998 IEEE International Conference on Semiconductor Electronics. Proceedings (Cat. No.98EX187).

[13]  Horng-Chih Lin,et al.  Post-soft-breakdown characteristics of deep submicron NMOSFETs with ultrathin gate oxide , 2001 .

[14]  Alejandro Avellán Hampe Charakterisierung von MOS-Transistoren vor und nach Gateoxiddurchbruch , 2004 .

[15]  Min-Yu Tsai,et al.  Post-soft-breakdown characteristics of deep submicron NMOSFETs with ultrathin gate oxide , 2001, IEEE Electron Device Letters.

[16]  I. Eisele,et al.  Influence of soft breakdown on NMOSFET device characteristics , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

[17]  A. Avellan,et al.  Experimental study and modeling of the temperature dependence of soft breakdown conduction in ultrathin gate oxides , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[19]  R. Rodriguez,et al.  Modeling and experimental verification of the effect of gate oxide breakdown on CMOS inverters , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[20]  J. Stathis Physical and predictive models of ultrathin oxide reliability in CMOS devices and circuits , 2001 .

[21]  Ernest Y. Wu,et al.  On the Weibull shape factor of intrinsic breakdown of dielectric films and its accurate experimental determination. Part I: theory, methodology, experimental techniques , 2002 .

[22]  Kenji Taniguchi,et al.  Electrical stress-induced variable range hopping conduction in ultrathin silicon dioxides , 1997 .

[23]  Barry P. Linder,et al.  Growth and scaling of oxide conduction after breakdown , 2003, 2003 IEEE International Reliability Physics Symposium Proceedings, 2003. 41st Annual..

[24]  H. Su,et al.  Yield optimization of analog MOS integrated circuits including transistor mismatch , 1993, 1993 IEEE International Symposium on Circuits and Systems.

[25]  N. Arora MOSFET Models for VLSI Circuit Simulation , 1993 .

[26]  Marc Heyns,et al.  Charge Transport after Hard Breakdown in Gate Oxides , 2002 .

[27]  Yi Liu,et al.  Effect of gate-oxide breakdown on RF performance , 2003 .

[28]  E. Vandamme,et al.  Impact of MOSFET gate oxide breakdown on digital circuit operation and reliability , 2000 .

[29]  Tanya Nigam,et al.  Soft breakdown in ultrathin gate oxides: Correlation with the percolation theory of nonlinear conductors , 1998 .

[30]  R. Degraeve,et al.  Consistent model for short-channel nMOSFET after hard gate oxide breakdown , 2002 .