THERMAL DESIGN CONSIDERATIONS FOR MULTICHIP MODULE APPLICATIONS

Operational integrity and longevity of electronic components are directly affected by their operating temperature. Thus the object in thermal design is to control the temperature sufficiently to meet the reliability requirements of the system. Achieving this goal requires the cooperation of many engineers on a design team. It also requires close attention of the thermal engineer. However, the relative ease or difficulty of achieving thermal aims depends a lot on design decisions made by the systems engineer, the logic and circuit engineers and the layout engineer. They also need to understand thermal design principles and processes.

[1]  Wataru Nakayama,et al.  Thermal Management of Electronic Equipment: A Review of Technology and Research Topics , 1986 .

[2]  David J. Klinger,et al.  AT&T reliability manual , 1990 .

[3]  Avram Bar-Cohen.  Thermal Management of Air- and Liquid-Cooled Multichip Modules , 1987 .

[4]  Hugh W. Coleman,et al.  Experimentation and Uncertainty Analysis for Engineers , 1989 .

[5]  Allan D. Kraus,et al.  Thermal Analysis and Control of Electronic Equipment , 1983 .

[6]  Y. Jaluria,et al.  An Introduction to Heat Transfer , 1950 .

[7]  R. J. Goldstein,et al.  Fluid Mechanics Measurements , 1983 .

[8]  Ephraim M Sparrow,et al.  Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment , 1982 .

[9]  C. Fletcher.  Computational techniques for fluid dynamics , 1992 .

[10]  Robert E. Simons,et al.  Recent Developments in Thermal Technology for Electronics Packaging , 1991 .

[11]  K. Azar.  Problem solving techniques in electronic cooling , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[12]  Richard A. Wirtz,et al.  Experimental Modeling of Convection Downstream from an Electronic Package Row , 1989 .

[13]  D. Mallik,et al.  Thermal characteristics of single and multi-layer high performance PQFP packages , 1990 .

[14]  J. Whitelaw,et al.  Convective heat and mass transfer , 1966 .

[15]  H. Hardisty,et al.  Thermal analysis of a dual-in-line package using the finite-element method , 1987 .

[16]  M. Kohara,et al.  High Thermal Conduction Package Technology for Flip Chip Devices , 1983 .

[17]  Glenn Murphy,et al.  Similitude in engineering , 1950 .

[18]  R. J. Goldstein,et al.  Measurements in Heat Transfer , 1976 .