Wafer Level Fine-Pitch Hybrid Bonding: Challenges and Remedies
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[1] F. Che,et al. Bonding integrity enhancement in wafer to wafer fine pitch hybrid bonding by advanced numerical modelling , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
[2] Daniel Smith,et al. Face to Face Hybrid Wafer Bonding for Fine Pitch Applications , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
[3] Andy Miller,et al. Novel Cu/SiCN surface topography control for 1 μm pitch hybrid wafer-to-wafer bonding , 2020, 2020 IEEE 70th Electronic Components and Technology Conference (ECTC).
[4] M. Kawano,et al. Wafer Level Fusion and Hybrid Bonding: Impact of Critical Process Parameters on Bond Quality , 2019, 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC).
[5] G. Fountain,et al. Recent Developments in Fine Pitch Wafer-To-Wafer Hybrid Bonding with Copper Interconnect , 2019, 2019 International Wafer Level Packaging Conference (IWLPC).
[6] V. Chidambaram,et al. High reliability gold based solder alloys for micro-electronics packaging for high temperature applications , 2012, 2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits.
[7] V. Chidambaram,et al. Development of Metallic Hermetic Sealing for MEMS Packaging for Harsh Environment Applications , 2012, Journal of Electronic Materials.