Decoupling Capacitor Placement in Power Delivery Networks Using MFEM
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[1] Peter P. Silvester,et al. Finite Elements for Electrical Engineers , 1983 .
[2] Madhavan Swaminathan,et al. Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM , 2008, 2008 45th ACM/IEEE Design Automation Conference.
[3] George A. Katopis,et al. Modeling, simulation, and measurement of mid-frequency simultaneous switching noise in computer systems , 1998 .
[4] R. Mittra,et al. Computational Methods for Electromagnetics , 1997 .
[5] J. M. Johnson,et al. Genetic algorithms in electromagnetics , 1996, IEEE Antennas and Propagation Society International Symposium. 1996 Digest.
[6] F. Y. Yuan. Analysis of power/ground noises and decoupling capacitors in printed circuit board systems , 1997, IEEE 1997, EMC, Austin Style. IEEE 1997 International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.97CH36113).
[7] Ruey-Beei Wu,et al. Optimization for the Locations of Decoupling Capacitors in Suppressing the Ground Bounce by Genetic Algorithm , 2005 .
[8] James L. Drewniak,et al. Power bus decoupling on multilayer printed circuit boards , 1995 .
[9] Jun Fan,et al. Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs , 2001 .
[10] C. Paul. Effectiveness of multiple decoupling capacitors , 1992 .
[11] T. Itoh. Numerical techniques for microwave and millimeter-wave passive structures , 1989 .
[12] Ayman Kayssi,et al. Capacitor placement for switching noise reduction using genetic algorithms and distributed computing , 2005 .
[13] Pingqiang Zhou,et al. Congestion-aware power grid optimization for 3D circuits using MIM and CMOS decoupling capacitors , 2009, 2009 Asia and South Pacific Design Automation Conference.
[14] Madhavan Swaminathan,et al. Power Integrity Modeling and Design for Semiconductors and Systems , 2007 .
[15] L.D. Smith,et al. Developing a decoupling methodology with SPICE for multilayer printed circuit boards , 1998, 1998 IEEE EMC Symposium. International Symposium on Electromagnetic Compatibility. Symposium Record (Cat. No.98CH36253).
[16] V. Sundaram,et al. Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package , 2007, IEEE Transactions on Advanced Packaging.
[17] Larry D. Smith,et al. Power distribution system design methodology and capacitor selection for modern CMOS technology , 1999 .
[18] Madhavan Swaminathan,et al. Designing and Modeling for Power Integrity , 2010, IEEE Transactions on Electromagnetic Compatibility.
[19] Eric Bogatin,et al. Signal and Power Integrity - Simplified , 2009 .
[20] M. Swaminathan,et al. Multilayered Finite-Difference Method (MFDM) for Modeling of Package and Printed Circuit Board Planes , 2007, IEEE Transactions on Electromagnetic Compatibility.
[21] Peter P. Silvester,et al. Finite elements for electrical engineers: Finite Elements for Electrical Engineers , 1996 .
[22] T. Okoshi,et al. The Planar Circuit - An Approach to Microwave Integrated Circuitry , 1972 .
[23] Sungjun Chun. Methodologies for modeling simultaneous switching noise in multi-layered packages and boards , 2002 .
[24] Madhavan Swaminathan,et al. Inductance and Resistance Calculations in Three-Dimensional Packaging Using Cylindrical Conduction-Mode Basis Functions , 2009, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.
[25] Madhavan Swaminathan,et al. Use of the finite element method for the modeling of multi-layered power/ground planes with small features , 2009, 2009 59th Electronic Components and Technology Conference.