Evaluation of producer's and consumer's risks in scatterometry and scanning electron microscopy metrology for inline critical dimension metrology

Measurement characteristics in scatterometry and critical dimension-scanning electron microscopy CD-SEM for lot acceptance sampling of inline CD metrology were investigated by using a statistical approach with Monte Carlo simulation. By operation characteristics curve analysis, producer's risk and consumer's risk arising from sam- pling were clarified. Single use of scatterometry involves a higher risk, such risk being particularly acute in the case of large intrachip CD varia- tion because it is unable to sufficiently monitor intrachip CD variation including local CD error. Substituting scatterometry for conventional SEM metrology is accompanied with risks, resulting in the increase of unnec- essary cost. The combined use of scatterometry and SEM metrology in which the sampling plan for SEM is controlled by scatterometry is a promising metrology from the viewpoint of the suppression of risks and cost. This is due to the effect that CD errors existing in the distribution tails are efficiently caught. © 2006 Society of Photo-Optical Instrumentation Engi-

[1]  Jeffrey L. Ringuest,et al.  Producer's and Consumer's Risk When Proportion Defective Is a Random Variable , 1991 .

[2]  Shunsuke Koshihara,et al.  Automated CD-SEM recipe creation: a new paradigm in CD-SEM utilization , 2006, SPIE Advanced Lithography.

[3]  Soichi Inoue,et al.  Run-to-run CD error analysis and control monitoring of effective dose and focus , 2003, SPIE Advanced Lithography.

[4]  Thaddeus Gerard Dziura,et al.  Advanced process control for poly-Si gate etching using integrated CD metrology , 2003, SPIE Advanced Lithography.

[5]  Ofer Adan,et al.  CD SEM metrology macro CD technology: beyond the average , 2005, SPIE Advanced Lithography.

[6]  Hideaki Abe,et al.  Sampling plan optimization for CD control in low k1 lithography , 2005, SPIE Advanced Lithography.

[7]  James McNames,et al.  Wafer sampling by regression for systematic wafer variation detection , 2005, SPIE Advanced Lithography.

[8]  Merritt Funk,et al.  Integrated scatterometry in high-volume manufacturing for polysilicon gate etch control , 2006, SPIE Advanced Lithography.

[9]  David Laidler,et al.  In-line lithography cluster monitoring and control using integrated scatterometry , 2004, SPIE Advanced Lithography.

[10]  John Allgair,et al.  Specifications, methodologies, and results of evaluation of optical critical dimension scatterometer tools at the 90nm CMOS technology node and beyond , 2005, SPIE Advanced Lithography.

[11]  Han-Ku Cho,et al.  Successful application of angular scatterometry to process control in sub-100-nm DRAM device , 2004, SPIE Advanced Lithography.

[12]  Yuichiro Yamazaki,et al.  Usage of profile information obtained with scatterometry , 2005, SPIE Advanced Lithography.

[13]  Luigi Capodieci Design-driven metrology: a new paradigm for DFM-enabled process characterization and control: extensibility and limitations , 2006, SPIE Advanced Lithography.