Crosstalk Modeling and Analysis of Through-Silicon-Via Connection in 3D Integration

For the wider bandwidth and the smaller form factor, high-speed I/O channel design in three-dimensional integrated circuit (3D IC) becomes more important. Through-Silicon- Via (TSV) is regarded as a critical component in 3D integration that extends Moore's Law. In TSV based 3D-IC systems, a signiflcant design consideration is the coupling noise between TSVs. This paper focuses on the TSV crosstalk analysis under high speed operations using a 3D electromagnetic fleld solver and a SPICE simulator. Efiects of the TSV radius, insulator thickness, and TSV pitch are investigated in details. In addition, the crosstalk performance of difierent TSV bus conflgurations is also evaluated and compared, which is one important consideration in high speed interconnection systems.