RF MEMS for ubiquitous wireless connectivity. Part II. Application

This paper reports on RF-MEMS switchable capacitors, varactors, and ohmic switch technology attribute for both base stations and handsets in realizing frequency-agile RF/wireless systems capable of serving multiple frequency bands. For the handset, this leads to a smaller footprint combined with low power consumption of the RF radio. For the base station the benefit lies in ability for reconfiguration of the air interface, which leads to high logistical savings for infrastructure vendors through a reduction in the number of product variants. Reconfigurable frequency-agile radios are a perfect addition to reconfigurable baseband processing. Both together form the basis of a realistic and reasonable approach to realize software radios.

[1]  Steven Brebels,et al.  The influence of packaging materials on RF performance , 2003, Microelectron. Reliab..

[2]  H. Tilmans,et al.  Electrostatically driven vacuum-encapsulated polysilicon resonators Part I. Design and fabrication , 1994 .

[3]  F. van Straten,et al.  Multiband cellular RF solutions , 2004, IEEE Journal of Solid-State Circuits.

[4]  Reza Abdolvand,et al.  Voltage-tunable piezoelectrically-transduced single-crystal silicon micromechanical resonators , 2004 .

[5]  Didier Belot,et al.  An above IC MEMS RF switch , 2003 .

[6]  Mourad N. El-Gamal,et al.  Wide tuning range RF-MEMS varactors fabricated using the polymumps foundry , 2003 .

[7]  H. D. L. Santos Introduction to Microelectromechanical(MEM)Microwave Systems , 1999 .

[8]  Khalil Najafi,et al.  An Ultra-Thin Hermetic Package Utilizing Electroplated Gold , 2001 .

[9]  A. Jourdain,et al.  Wafer-level packaged RF-MEMS switches fabricated in a CMOS fab , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

[10]  Ken Gilleo,et al.  Getters — Molecular Scavengers for Packaging , 2001 .

[11]  A. Jourdain,et al.  Optimization of 0-level packaging for RF-MEMS devices , 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

[12]  Gabriel M. Rebeiz RF MEMS: Theory, Design and Technology , 2003 .

[13]  Georg Fischer,et al.  RF-MEMS and SiC/GaN as enabling technologies for a reconfigurable multi-band/multi-standard radio , 2003, Bell Labs Technical Journal.

[14]  Gabriel M. Rebeiz,et al.  MEMS Switch Reliability and Power Handling , 2004 .

[15]  Dimitrios Peroulis,et al.  Silicon Micromachined Packages for RF MEMS Switches , 2001, 2001 31st European Microwave Conference.

[16]  J. De Coster,et al.  Passive integration and RF MEMS: a toolkit for adaptive LC circuits , 2003, ESSCIRC 2004 - 29th European Solid-State Circuits Conference (IEEE Cat. No.03EX705).

[17]  Jun Shen,et al.  Latching micromagnetic relays , 2001 .

[18]  S. J. Gross,et al.  Lead-zirconate-titanate-based piezoelectric micromachined switch , 2003 .

[19]  M. Fujii,et al.  RF MEMS Switch with Wafer Level Package Utilizing Frit Glass Bonding , 2002, 2002 32nd European Microwave Conference.

[20]  R. Wilfinger,et al.  A frequency selective device utilizing the mechanical resonance of a silicon substrate , 1966 .

[21]  K. Maruhashi,et al.  Low cost multi-layer ceramic package for flip-chip MMIC up to W-band , 2000, 2000 IEEE MTT-S International Microwave Symposium Digest (Cat. No.00CH37017).

[22]  J.U. Bu,et al.  Micromachined RF MEMS tunable capacitors using piezoelectric actuators , 2001, 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No.01CH37157).

[23]  G Fischer Architectural benefits of wide bandgap RF power transistors for frequency agile basestation systems , 2004 .

[24]  Jan H. J. Fluitman,et al.  Performance of thermally excited resonators , 1990 .

[25]  J. de Coster,et al.  RF MEMS tunable capacitors with large tuning ratio , 2004, 17th IEEE International Conference on Micro Electro Mechanical Systems. Maastricht MEMS 2004 Technical Digest.

[26]  S.M. Kuo,et al.  Motorola MEMS switch technology for high frequency applications , 2001, 2001 Microelectromechanical Systems Conference (Cat. No. 01EX521).

[27]  Khalil Najafi Micropackaging Technologies for Integrated Microsystems: Applications to MEMS and MOEMS , 2003, SPIE MOEMS-MEMS.

[28]  Jaap M. J. den Toonder,et al.  Optimization of mechanical properties of thin free-standing metal films for RF-MEMS , 2004 .

[29]  E. Beyne,et al.  A fully-packaged electromagnetic microrelay , 1999, Technical Digest. IEEE International MEMS 99 Conference. Twelfth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.99CH36291).

[30]  J.G. Smits,et al.  The constituent equations of piezoelectric heterogeneous bimorphs , 1991, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control.

[31]  A. Jourdain,et al.  Investigation of the hermeticity of BCB-sealed cavities for housing (RF-)MEMS devices , 2002, Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266).

[32]  A. Witvrouw,et al.  Thin film encapsulation of acceleration sensors using polysilicon sacrificial layers , 2003, TRANSDUCERS '03. 12th International Conference on Solid-State Sensors, Actuators and Microsystems. Digest of Technical Papers (Cat. No.03TH8664).

[33]  Vladimir Ermolov,et al.  The micromechanical structure , 2000 .

[34]  Robert Puers,et al.  High-Q integrated RF passives and RF-MEMS on silicon , 2003 .

[35]  Robert Puers,et al.  Pull-in voltage analysis of electrostatically actuated beam structures with fixed–fixed and fixed–free end conditions , 2002 .