A ULSI 2-D capacitance simulator for complex structures based on actual processes
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Shin Nakamura | Naoyuki Shigyo | Koichi Kato | Sanae Fukuda | N. Shigyo | Koichi Kato | S. Fukuda | Shin Nakamura
[1] T. Wada,et al. A supervised simulation system for process and device designs based on a geometrical data interface , 1987, IEEE Transactions on Electron Devices.
[2] J. M. Crotty. A block equation solver for large unsymmetric matrices arising in the boundary integral equation method , 1982 .
[3] K. Kato,et al. TRIMEDES: a triangular mesh device simulator linked with topography/process simulation , 1988 .
[4] J. Watson,et al. Effective numerical treatment of boundary integral equations: A formulation for three‐dimensional elastostatics , 1976 .
[5] J. C. Lachat,et al. Progress in the use of boundary integral equations, illustrated by examples , 1977 .
[6] C. Brebbia,et al. Boundary Element Techniques , 1984 .
[7] N. Shigyo,et al. Coupling capacitances for two-dimensional wires , 1981, IEEE Electron Device Letters.
[8] E. M. Buturla,et al. VLSI wiring capacitance , 1985 .
[9] Albert Seidl,et al. CAPCAL-a 3-D capacitance solver for support of CAD systems , 1988, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[10] H. Ono,et al. A three-level wiring capacitance analysis for VLSIs using a three-dimensional simulator , 1988, Technical Digest., International Electron Devices Meeting.
[11] I. Avigal. Inter-metal dielectric and passivation-related properties of plasma BPSG , 1983 .
[12] Masashi Horiguchi,et al. The impact of data-line interference noise on DRAM scaling , 1988 .
[13] A. Ralston. A first course in numerical analysis , 1965 .
[14] Masao Fukuma,et al. Process-Based Three-Dimensional Capacitance Simulation -- TRICEPS , 1986, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems.