Effect of Vibration Transmissibility on Fatigue Lifetime of Electronic Devices
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[1] Yves Danto,et al. Vibration lifetime modelling of PCB assemblies using steinberg model , 2005, Microelectron. Reliab..
[2] Shaw Fong Wong,et al. A mechanical fatigue assessment methodology to study solder joint reliability , 2008, 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT).
[3] A. P. V. Urgueira,et al. On the use of the transmissibility concept for the evaluation of frequency response functions , 2011 .
[4] Ron S. Li. A Methodology for Fatigue Prediction of Electronic Components Under Random Vibration Load , 2001 .
[5] Fang Liu,et al. Random vibration reliability of BGA lead-free solder joint , 2014, Microelectron. Reliab..
[6] Christof Devriendt,et al. On the use of transmissibility measurements for finite element model updating , 2007 .
[7] S. Manson. Fatigue: A complex subject—Some simple approximations , 1965 .
[8] D. S. Steinberg,et al. Vibration analysis for electronic equipment , 1973 .
[9] Mei-Ling Wu. Vibration-induced fatigue life estimation of ball grid array packaging , 2009 .
[10] Jae Hyuk Lim,et al. A correlation study of satellite finite element model for coupled load analysis using transmissibility with modified correlation measures , 2014 .
[11] Simon Chesne,et al. Damage localization using transmissibility functions: A critical review , 2013 .
[12] Ying Chen,et al. Applicability study of Steinberg vibration fatigue model in electronic products , 2014, 2014 Prognostics and System Health Management Conference (PHM-2014 Hunan).