论文信息 - Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages - 字舞流文

Electromigration lifetime statistics for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages

K. Lu | P. Ho | Xuefeng Zhang | P. Su | Min Ding | Seung-Hyun Chae | T. Uehling | L. Ramanathan | H. Chao