Laser projection UV lithography on subliming resists
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One of the alldry microlithographic processes is considered which includes only two operat ions namely vacuum thermal evaporat ion of the res i st f i lm and subsequent patterning of the mask directly during exposure with laser radiation of A 266 nm. The mask patterning is performed on a projection lithography apparatus. Theoreticaland experimental results indicate that the proposed process permits formation of submicron features with high accuracy and relatively low requirements to the exposure dose control. 1 .
[1] Akira Morinaka,et al. Heat‐Mode Lithography with Dye Deposited Films , 1988 .