Metal-Transfer-Micromolded RF Components for System-On-Package (SOP)

This paper reports a metal-transfer-micromolding (MTM) technique for simultaneous implementation of metallized high aspect ratio molded polymer RF passive components, as well as an organic RF circuit board, in a high performance and cost-effective fashion. A system on package (SOP) integration scheme of air lifted RF components can be realized by this process. Two test vehicles have been utilized to demonstrate the feasibility of the proposed process: planar coplanar waveguide (CPW)-based band stop filters and an airlifted monopole antenna array, both operating in Ka-band. The measured filter characteristic shows a loss of less than 2.5 dB in passband and 20 dB in stopband, which agrees well with HFSS10.0 simulations. The monopole antennas show good radiation performance and the 10 dB bandwidths at the resonant radiation frequencies are as large as 21.5% for the tested structures.

[1]  R.R. Tummala,et al.  The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.

[2]  W.J. Chappell,et al.  Applications of layer-by-layer polymer stereolithography for three-dimensional high-frequency components , 2004, IEEE Transactions on Microwave Theory and Techniques.

[4]  E. Yeatman,et al.  High Q Achieved in Microwave Inductors Fabricated by Parallel Self-Assembly , 2001 .

[5]  M. Tentzeris,et al.  Analysis and Characterization of a High-Performance Ka-Band Surface Micromachined Elevated Patch Antenna , 2006, IEEE Antennas and Wireless Propagation Letters.

[6]  Ching-Ping Wong,et al.  Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics , 1999 .

[7]  John A. Rogers,et al.  Nanotransfer printing by use of noncovalent surface forces: Applications to thin-film transistors that use single-walled carbon nanotube networks and semiconducting polymers , 2004 .

[8]  Linda P. B. Katehi,et al.  Micromachined patch antennas , 1998 .

[9]  David M. Pozar,et al.  Considerations for millimeter wave printed antennas , 1983 .

[10]  F. K. Schwering,et al.  Millimeter wave antennas , 1992, Proc. IEEE.

[11]  J. Laskar,et al.  Integrated inductors in the chip-to-board interconnect layer fabricated using solderless electroplating bonding , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).

[13]  T.M. Weller,et al.  Miniature stub and filter designs using the microshield transmission line , 1995, Proceedings of 1995 IEEE MTT-S International Microwave Symposium.

[14]  Characterization and attenuation mechanism of CMOS-compatible micromachined edge-suspended coplanar waveguides on low-resistivity silicon substrate , 2006, IEEE Transactions on Advanced Packaging.

[15]  J. Papapolymerou,et al.  A high performance surface-micromachined elevated patch antenna , 2005, 2005 IEEE Antennas and Propagation Society International Symposium.

[16]  M.G. Allen,et al.  Polymer-core conductor approaches for RF MEMS , 2005, Journal of Microelectromechanical Systems.