Determination of New Layout in a Semiconductor Packaging Substrate Line using Simulation and AHP/DEA

The process of semiconductor(IC Package) manufacturing usually includes lots of complex and sequential processes. Many kinds of equipments are installed with the mixed concept of serial and parallel manufacturing system. The business environments of the semiconductor industry have been changed frequently, because new technologies are developed continuously. It is the main reason of new investment plan and layout consideration. However, it is difficult to change the layout after installation, because the major equipments are expensive and difficult to move. Furthermore, it is usually a multiple-objective problem. Thus, new investment or layout change should be carefully considered when the production environments likewise product mix and production quantity are changed. This paper introduces a simulation case study of a Korean company that produces packaging substrates(especially lead frames) and requires multi-objective decision support. is used for simulation modelling and AHP(Analytic Hierarchy Process) and DEA(Data Envelopment Analysis) are used for weighting of qualitative performance measures and solving multiple-objective layout problem, respectively.