Peridynamic Modeling of Diffusion by Using Finite-Element Analysis

Diffusion modeling is essential in understanding many physical phenomena such as heat transfer, moisture concentration, and electrical conductivity. In the presence of material and geometric discontinuities and nonlocal effects, a nonlocal continuum approach, named peridynamics (PD), can be advantageous over the traditional local approaches. PD is based on integro-differential equations without including any spatial derivatives. In general, these equations are solved numerically by employing meshless discretization techniques. Although fundamentally different, commercial finite-element software can be a suitable platform for PD simulations that may result in several computational benefits. Hence, this paper presents the PD diffusion modeling and implementation procedure in a widely used commercial finite-element analysis software, ANSYS. The accuracy and capability of this approach is demonstrated by considering several benchmark problems.

[1]  Selda Oterkus,et al.  Simulation of electro-migration through peridynamics , 2013, 2013 IEEE 63rd Electronic Components and Technology Conference.

[2]  S. Silling,et al.  Peridynamics via finite element analysis , 2007 .

[3]  N. SIAMJ.,et al.  ANALYSIS AND COMPARISON OF DIFFERENT APPROXIMATIONS TO NONLOCAL DIFFUSION AND LINEAR PERIDYNAMIC EQUATIONS∗ , 2013 .

[4]  S. Silling,et al.  A meshfree method based on the peridynamic model of solid mechanics , 2005 .

[5]  S. Silling Reformulation of Elasticity Theory for Discontinuities and Long-Range Forces , 2000 .

[6]  Florin Bobaru,et al.  The peridynamic formulation for transient heat conduction , 2010 .

[7]  Qiang Du,et al.  Nonlocal convection–diffusion problems and finite element approximations , 2015 .

[8]  Erkan Oterkus,et al.  Hygro-thermo-mechanical analysis and failure prediction in electronic packages by using peridynamics , 2014, 2014 IEEE 64th Electronic Components and Technology Conference (ECTC).

[9]  R. Lehoucq,et al.  Peridynamic Simulation of Electromigration , 2008 .

[10]  Qiang Du,et al.  Asymptotically compatible schemes for the approximation of fractional Laplacian and related nonlocal diffusion problems on bounded domains , 2016, Adv. Comput. Math..

[11]  Qiang Du,et al.  Asymptotically Compatible Schemes and Applications to Robust Discretization of Nonlocal Models , 2014, SIAM J. Numer. Anal..

[12]  Qiang Du,et al.  Analysis and Comparison of Different Approximations to Nonlocal Diffusion and Linear Peridynamic Equations , 2013, SIAM J. Numer. Anal..

[13]  Thiam Beng Lim,et al.  Moisture diffusion and vapour pressure modeling of IC packaging , 1998, 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206).

[14]  Selda Oterkus,et al.  Fully coupled peridynamic thermomechanics , 2014 .

[15]  Selda Oterkus,et al.  Peridynamic thermal diffusion , 2014, J. Comput. Phys..