Passive alignment bonding method for transceiver module using laser local heating method

The present invention, only localized heating in a that discloses a method of passive alignment access those multiple optical elements, is to install a laser on the substrate lower in order to overcome the disadvantages caused disorder entirely conventional by heating parts on a single substrate by it characterized in that the connection cut the optical element arranged on the substrate in sequence. According to the invention, can be connected without affecting the other optical elements in the area, and it can solve the problem of disturbance of the existing, it is advantageous for a plurality of optical element that make up the array. Optical device, local heating, passive alignment