A temperature gradient based routing algorithm on 3D NoC

3D NoC has the advantages of low communication delay, low power consumption and high data throughput, but, at the same time, suffers from heat dissipation problem. We propose the concept of temperature gradient as the basis for 3D NoCs routing. By monitoring the temperature of every node, the run-time temperature management (RTM) can calculate the temperature gradient map, and the routing decision can be made by choosing the coolest path for routing. Experiments show that the proposed approach has not only has shorter packet delay (17% improvement) and higher throughput (19.2% improvement), but also lower average temperature (decreased by 2.81oK) than the Edge routing algorithm.

[1]  Li Shang,et al.  Thermal Modeling, Characterization and Management of On-Chip Networks , 2004, 37th International Symposium on Microarchitecture (MICRO-37'04).

[2]  Partha Pratim Pande,et al.  Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation , 2009, IEEE Transactions on Computers.

[3]  Terrence S. T. Mak,et al.  Design and Implementation of Dynamic Thermal-Adaptive Routing Strategy for Networks-on-Chip , 2014, 2014 22nd Euromicro International Conference on Parallel, Distributed, and Network-Based Processing.

[4]  Kevin Skadron,et al.  HotSpot: a compact thermal modeling methodology for early-stage VLSI design , 2006, IEEE Transactions on Very Large Scale Integration (VLSI) Systems.

[5]  Yao Li,et al.  A study on thermal impacts of routing algorithms for 3D mesh-based network-on-chip , 2012 .

[6]  An-Yeu Wu,et al.  Traffic- and Thermal-Aware Run-Time Thermal Management Scheme for 3D NoC Systems , 2010, 2010 Fourth ACM/IEEE International Symposium on Networks-on-Chip.

[7]  An-Yeu Wu,et al.  Transport-layer-assisted routing for runtime thermal management of 3D NoC systems , 2013, TECS.

[8]  Andrew B. Kahng,et al.  ORION 2.0: A fast and accurate NoC power and area model for early-stage design space exploration , 2009, 2009 Design, Automation & Test in Europe Conference & Exhibition.